HASL; Hot Air Solder Leveling 공정 - 뜨거운 공기 나이프 사이에서 PCB를 통과시켜 과도한 땜납을 예방

→ 쉽게말해, 적당한 온도로 맞춰줘야 땜납이 과도하지 않게 잘 되는데 PCB에 땜납하기전 구리 표면을 달궈주는 공정입니다.

마감쪽 공정입니다.

조금 더 자세한 내용을 원하시면 아래 내용 참고바랍니다.

HASL or hot air solder leveling is a type of finish used on printed circuit boards (PCBs).

The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives.

[출처] https://en.wikipedia.org

  PCB 제조에 사용되는 납땜 공정으로 PCB에 조립한 부품들을 납땜해 고정.

자세한 내용은 아래 내용 및 동영상 참조.

  Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave. Wave soldering is mainly used in soldering of through hole components.

As through-hole components have been largely replaced by surface mount components, wave soldering has been supplanted by reflow soldering methods in many large-scale electronics applications. However, there is still significant wave soldering where surface-mount technology (SMT) is not suitable (e.g., large power devices and high pin count connectors), or where simple through-hole technology prevails (certain major appliances).

[출처] https://en.wikipedia.org